The Optics Laboratory
Group of Hans Hallen, Physics Department, North Carolina State University

A Smart Barrier/Seed Layer for Electroless Deposition on Edges and in Vias

Although electroless deposition with SAM layers has been demonstrated, we emphasize here its optimization for copper deposition using a SAM that provides better thermal stability and barrier properties and using a better catalyst system than previous related studies. We find qualitative insights, especially to the catalyst optimization for mechanical properties, and quantitative recommendations for process steps for thin layer resistivity optimization. The resistivity of the outermost thin layer is critical for high frequency (RF) applications, thus our optimization of this layer is important. Finally, we have taken a new strategy in via hole filling by using a ‘smart’ seed in a ‘dumb’ hole rather than expending extraordinary effort to create a smooth tapered hole for simple physical deposition of a seed layer.

  • More to come once the paper comes out...

  •  More info is in the papers.

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